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2010-06-23
Carriers manage inventory ahead of iPhone 4 launch
2010-06-23
TPV-Inventec joint venture to be set up in Hong Kong not Taiwan
2010-06-23
Rexchip elects new board members
2010-06-22
UMC expects to sample 3D stacked chips using 28nm in 2011
2010-06-21
Elpida, PTI and UMC enter joint development deal for 3D-TSV technology
2010-06-21
Powerchip surges in 1Q10 DRAM ranking
2010-06-21
Winbond president:NOR flash supply gap reaches 20%
2010-06-21
ProMOS says trial production for Elpida 63nm DDR3 chips a success
2010-06-18
DRAM spot market still quiet
2010-06-18
Current DRAM chip prices are too high
2010-06-18
IC distributor Zenitron expects record high 3Q10 revenues
2010-06-17
SPIL to raise 2010 capex budget for copper wire bonding equipment procurement
2010-06-15
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Update: 11-05 20:17,Data has delay
Samsung KRW 100600 -4.10%
SK Hynix KRW 579000 -1.19%
KIOXIA JPY 10545 -2.00%
Micron USD 218.030 -7.10%
WDC USD 152.180 -3.70%
SanDisk USD 194.570 -6.01%
Nanya TWD 138.0 +4.94%
Winbond TWD 56.0 +5.07%
Phison TWD 1085 +3.83%
SMI USD 92.290 -5.50%
Maxio CNY 53.99 -1.96%
ASolid TWD 70.5 -2.08%
Longsys CNY 259.00 -1.81%
Seagate USD 250.380 -5.71%
Innodisk TWD 441.5 +3.64%
Transcend TWD 129.0 +0.78%
A-DATA TWD 187.0 +3.31%
PENG USD 21.520 -4.78%
Netac CNY 29.35 -1.54%
BWCC CNY 124.90 +2.44%
Techwinsemi CNY 224.67 +0.30%
DAWEI CNY 27.70 +3.32%
OSE TWD 47.90 +0.21%
PTI TWD 172.5 -0.86%
JCET CNY 38.88 -2.36%
ASE TWD 235.0 -1.67%
TFME CNY 40.16 -1.76%
HT-tech CNY 11.84 -1.42%