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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2013-04-19
Chipmaker TSMC gets tablet, smartphone boost in 1Q
2013-04-19
AMD results beat expectations in declining PC market
2013-04-19
Samsung says the Galaxy S4 might use Hynix DRAM
2013-04-19
ASE, SPIL 2Q13 sales outlook optimistic
2013-04-19
ChipMOS sees orders for NAND flash, driver ICs pick up
2013-04-19
Samsung to launch Galaxy S4 at end of April in 50 countries
2013-04-19
Companies gearing up for USB 3.0 hub market boom
2013-04-19
NAND memory market rockets
2013-04-19
Smartphones will use 26% of NAND flash in 2013
2013-04-18
Brazil launches 4G wireless service with few smartphone options
2013-04-18
Apple reportedly stops placing Mac component orders
2013-04-18
Asustek Computer's 1Q Notebook Shipments up 15% on Year
2013-04-18
Foxconn to pay Microsoft for production of Android/Chrome devices
2013-04-17
iPad mini shipments expected to drop as high as 30% in 2Q13
2013-04-17
Memory makers see better profits as chip pricing improves

 

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Update: 11-20 04:29,Data has delay
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