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2010-06-23
Carriers manage inventory ahead of iPhone 4 launch
2010-06-23
TPV-Inventec joint venture to be set up in Hong Kong not Taiwan
2010-06-23
Rexchip elects new board members
2010-06-22
UMC expects to sample 3D stacked chips using 28nm in 2011
2010-06-21
Elpida, PTI and UMC enter joint development deal for 3D-TSV technology
2010-06-21
Powerchip surges in 1Q10 DRAM ranking
2010-06-21
Winbond president:NOR flash supply gap reaches 20%
2010-06-21
ProMOS says trial production for Elpida 63nm DDR3 chips a success
2010-06-18
DRAM spot market still quiet
2010-06-18
Current DRAM chip prices are too high
2010-06-18
IC distributor Zenitron expects record high 3Q10 revenues
2010-06-17
SPIL to raise 2010 capex budget for copper wire bonding equipment procurement
2010-06-15
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Update: 11-01 06:20,Data has delay
Samsung KRW 107500 +3.27%
SK Hynix KRW 559000 -1.58%
KIOXIA JPY 10825 -0.69%
Micron USD 223.770 -0.11%
WDC USD 150.210 +8.75%
SanDisk USD 199.330 +1.79%
Nanya TWD 132.5 -1.49%
Winbond TWD 54.2 -1.81%
Phison TWD 1065 -4.05%
SMI USD 98.110 -1.85%
Maxio CNY 57.18 -5.95%
ASolid TWD 78.6 -1.87%
Longsys CNY 261.31 -7.66%
Seagate USD 255.880 -4.64%
Innodisk TWD 431.0 +0.58%
Transcend TWD 132.5 -1.12%
A-DATA TWD 198.0 -0.50%
PENG USD 22.270 -0.76%
Netac CNY 30.45 -3.97%
BWCC CNY 131.00 -3.46%
Techwinsemi CNY 228.24 +0.95%
DAWEI CNY 28.02 +3.89%
OSE TWD 48.60 +0.83%
PTI TWD 173.0 -2.26%
JCET CNY 40.02 -3.80%
ASE TWD 247.5 +10.00%
TFME CNY 42.45 -4.99%
HT-tech CNY 12.06 -1.71%