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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
Samsung Electronics Supplies SSDs for Nvidia’s DGX Spark Supercomputer  25/10/29
The PM9E1 is Samsung Electronics’ industry-leading PC SSD in terms of performance and capacity, with sequential read and write speeds of up to 14.5 gigabytes (GB) per second.
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2018-03-12
Intel Considers Buying Out Broadcom
2018-03-12
Original vendors plus investment in new Fab factory and 3D NAND production competition, the market in 2018 may be over-supply
2018-03-09
In 2018,256GB is expected to enter the high-end mobile phone market
2018-03-09
Silicon wafer prices to rise over 30%, says Macronix chairman
2018-03-07
2018 SSD is expected to become the largest NAND Flash applications market
2018-03-06
Global wearable market grows 7.7% in 4Q17 and 10.3% in 2017, says IDC
2018-03-06
Qualcomm is pushing back its pivotal shareholder meeting this week amid a regulatory review
2018-03-05
Global chip sales increase 21.6% in 2017, says SIA
2018-03-05
Southeast Asia smartphone shipments flat in 2017, says IDC
2018-03-05
Samsung counting on micro LED to revive TV shipments in 2018
2018-02-28
Samsung Galaxy 9 to be available on March 16
2018-02-28
Lenovo Reveals the Yoga 730 and Yoga 530 2-in-1 Laptops with Alexa Support
2018-02-27
Qualcomm Comes Around to Broadcom Acquisition, Wants the Price to be Right
2018-02-27
MediaTek unveils Helio P60 chipset
2018-02-27
China smartphone AP shipments to fall 18% in 1Q18

 

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Update: 11-07 21:17,Data has delay
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