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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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The PM9E1 is Samsung Electronics’ industry-leading PC SSD in terms of performance and capacity, with sequential read and write speeds of up to 14.5 gigabytes (GB) per second.
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2010-06-24
Elpida develops 2Gb GDDR5
2010-06-24
SDRAM maker Etron to ship USB 3.0 controllers in 4Q10
2010-06-23
Carriers manage inventory ahead of iPhone 4 launch
2010-06-23
TPV-Inventec joint venture to be set up in Hong Kong not Taiwan
2010-06-23
Rexchip elects new board members
2010-06-22
UMC expects to sample 3D stacked chips using 28nm in 2011
2010-06-21
Elpida, PTI and UMC enter joint development deal for 3D-TSV technology
2010-06-21
Powerchip surges in 1Q10 DRAM ranking
2010-06-21
Winbond president:NOR flash supply gap reaches 20%
2010-06-21
ProMOS says trial production for Elpida 63nm DDR3 chips a success
2010-06-18
DRAM spot market still quiet
2010-06-18
Current DRAM chip prices are too high
2010-06-18
IC distributor Zenitron expects record high 3Q10 revenues
2010-06-17
SPIL to raise 2010 capex budget for copper wire bonding equipment procurement
2010-06-15
Nanya to volume produce mobile RAM chips in 3Q10

 

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Update: 11-07 11:53,Data has delay
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