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Samsung launches dedicated HBM, advanced chip packaging teams 24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
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Date
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2024-07-15 2.28
2024-07-12 2.28
2024-07-11 2.28
2024-07-10 2.28
2024-07-09 2.28
2024-07-08 2.28
2024-07-05 2.28
2024-07-04 2.3
2024-07-03 2.4
2024-07-02 2.5
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2024-06-27 2.7
2024-06-26 2.7
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2024-06-20 2.7
2024-06-19 2.7
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2024-06-17 2.7
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2024-06-13 2.8
2024-06-12 3
2024-06-11 3.15
2024-06-07 3.3
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2024-06-03 3.3
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2024-05-28 3.3
2024-05-27 3.3
2024-05-24 3.3
2024-05-23 3.3
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2024-05-21 3.3
2024-05-20 3.3
2024-05-17 3.3
2024-05-16 3.3
2024-05-15 3.3
2024-05-14 3.3
2024-05-13 3.3
2024-05-10 3.3
2024-05-09 3.3
2024-05-08 3.3
2024-05-07 3.3
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2024-04-30 3.3
2024-04-29 3.3
2024-04-26 3.3
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2024-04-23 3.3
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2024-04-19 3.3
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2024-04-17 3.3
2024-04-16 3.4