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Samsung launches dedicated HBM, advanced chip packaging teams 24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
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Date
Price
2024-07-15 1.7
2024-07-12 1.7
2024-07-11 1.7
2024-07-10 1.7
2024-07-09 1.7
2024-07-08 1.7
2024-07-05 1.7
2024-07-04 1.7
2024-07-03 1.7
2024-07-02 1.7
2024-07-01 1.85
2024-06-28 1.85
2024-06-27 1.85
2024-06-26 1.85
2024-06-25 1.85
2024-06-24 1.85
2024-06-21 1.85
2024-06-20 1.85
2024-06-19 1.85
2024-06-18 1.85
2024-06-17 1.85
2024-06-14 1.85
2024-06-13 1.94
2024-06-12 2
2024-06-11 2.05
2024-06-07 2.1
2024-06-06 2.1
2024-06-05 2.1
2024-06-04 2.1
2024-06-03 2.1
2024-05-31 2.1
2024-05-30 2.1
2024-05-29 2.1
2024-05-28 2.1
2024-05-27 2.1
2024-05-24 2.1
2024-05-23 2.1
2024-05-22 2.1
2024-05-21 2.1
2024-05-20 2.1
2024-05-17 2.1
2024-05-16 2.1
2024-05-15 2.1
2024-05-14 2.1
2024-05-13 2.1
2024-05-10 2.1
2024-05-09 2.1
2024-05-08 2.1
2024-05-07 2.1
2024-05-06 2.1
2024-04-30 2.1
2024-04-29 2.1
2024-04-26 2.1
2024-04-25 2.1
2024-04-24 2.1
2024-04-23 2.1
2024-04-22 2.2
2024-04-19 2.2
2024-04-18 2.2
2024-04-17 2.2
2024-04-16 2.3