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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
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2023-11-29 1.5 1.5 1.5
2023-11-28 1.5 1.5 1.5
2023-11-27 1.5 1.5 1.5
2023-11-24 1.5 1.5 1.5
2023-11-23 1.5 1.5 1.5
2023-11-22 1.5 1.5 1.5
2023-11-21 1.47 1.47 1.47
2023-11-20 1.4 1.4 1.4
2023-11-17 1.4 1.4 1.4
2023-11-16 1.4 1.4 1.4
2023-11-15 1.4 1.4 1.4
2023-11-14 1.4 1.4 1.4
2023-11-13 1.4 1.4 1.4
2023-11-10 1.4 1.4 1.4
2023-11-09 1.4 1.4 1.4
2023-11-08 1.4 1.4 1.4
2023-11-07 1.4 1.4 1.4
2023-11-06 1.4 1.4 1.4
2023-11-03 1.4 1.4 1.4
2023-11-02 1.4 1.4 1.4
2023-11-01 1.4 1.4 1.4
2023-10-31 1.4 1.4 1.4
2023-10-30 1.4 1.4 1.4