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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
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2023-11-29 2.8 2.8 2.8
2023-11-28 2.7 2.7 2.7
2023-11-27 2.6 2.6 2.6
2023-11-24 2.6 2.6 2.6
2023-11-23 2.6 2.6 2.6
2023-11-22 2.6 2.6 2.6
2023-11-21 2.6 2.6 2.6
2023-11-20 2.6 2.6 2.6
2023-11-17 2.6 2.6 2.6
2023-11-16 2.6 2.6 2.6
2023-11-15 2.6 2.6 2.6
2023-11-14 2.4 2.4 2.5
2023-11-13 2.4 2.4 2.4
2023-11-10 2.4 2.4 2.4
2023-11-09 2.4 2.4 2.4
2023-11-08 2.4 2.4 2.4
2023-11-07 2.4 2.4 2.4
2023-11-06 2.35 2.35 2.35
2023-11-03 2.3 2.3 2.3
2023-11-02 2.3 2.3 2.3
2023-11-01 2.3 2.3 2.3
2023-10-31 2.3 2.3 2.3
2023-10-30 2.2 2.2 2.2