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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
Historical Price Information:
Date
Low
High
Avg
2023-11-28 9.5 12.5 11.8
2023-11-21 9.5 12.5 11.8
2023-11-14 9.5 12.5 11.8
2023-11-07 8.7 11.7 11
2023-10-31 8.7 11.7 11
2023-10-24 8.2 11.2 10.5
2023-10-17 7.5 10.5 9.8
2023-10-10 7.5 10.5 9.8
2023-09-26 7.5 10.5 9.8
2023-09-19 7.3 10.3 9.6
2023-09-12 7.2 10.2 9.5
2023-09-05 7.1 10.1 9.4