Contact us
Enter Chinese version
>>
Home
Price Center
Market News
Company
CFMS 2023
Hot news
SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM
23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
Historical Price Information:
Last 3 months
2023 Q4
2023 Q3
2023 Q2
2023 Q1
2022 Q4
2022 Q3
2022 Q2
2022 Q1
2021 Q4
2021 Q3
2021 Q2
2021 Q1
2020 Q4
2020 Q3
2020 Q2
2020 Q1
2019 Q4
2019 Q3
2019 Q2
2019 Q1
Date
Low
High
Avg
2023-11-28
6.4
8.4
7.4
2023-11-21
6.4
8.4
7.4
2023-11-14
6.4
8.4
7.4
2023-11-07
6.2
8.2
7.2
2023-10-31
6.2
8.2
7.2
2023-10-24
6
8
7
2023-10-17
5.2
7.2
6.2
2023-10-10
5.2
7.2
6.2
2023-09-26
5.2
7.2
6.2
2023-09-19
5.2
7.2
6.2
2023-09-12
5
7
6
2023-09-05
4.8
6.8
5.8