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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
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Date
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High
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2023-11-28 6.4 8.4 7.4
2023-11-21 6.4 8.4 7.4
2023-11-14 6.4 8.4 7.4
2023-11-07 6.2 8.2 7.2
2023-10-31 6.2 8.2 7.2
2023-10-24 6 8 7
2023-10-17 5.2 7.2 6.2
2023-10-10 5.2 7.2 6.2
2023-09-26 5.2 7.2 6.2
2023-09-19 5.2 7.2 6.2
2023-09-12 5 7 6
2023-09-05 4.8 6.8 5.8