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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
Historical Price Information:
Date
Low
High
Avg
2023-11-28 15 18.8 16
2023-11-21 15 18.8 16
2023-11-14 14 17.8 15
2023-11-07 13 16.8 14
2023-10-31 13 16.8 14
2023-10-24 12 15.8 13
2023-10-17 12 15.8 13
2023-10-10 11.5 15.3 12.5
2023-09-26 11 14.8 12
2023-09-19 10.7 14.5 11.7
2023-09-12 10.5 14.3 11.5
2023-09-05 10.5 14.3 11.5