Hot news
SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
Historical Price Information:
Date
Low
High
Avg
2023-11-28 1.7 1.95 1.85
2023-11-21 1.7 1.95 1.85
2023-11-14 1.65 1.9 1.8
2023-11-07 1.65 1.9 1.8
2023-10-31 1.65 1.9 1.8
2023-10-24 1.65 1.9 1.8
2023-10-17 1.65 1.9 1.75
2023-10-10 1.55 1.8 1.65
2023-09-26 1.55 1.8 1.65
2023-09-19 1.5 1.75 1.6
2023-09-12 1.5 1.6 1.55
2023-09-05 1.5 1.6 1.55