LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum of understanding (MOU) to jointly provide customers with turnkey packaging and testing solutions for power ICs.
Chipbond said it will provide thick copper process technology while KYEC handles wafer probing. The pair will target non-driver IC segments, mainly power solutions.
Chipbond expects to move thick copper process to volume production in the second half of 2011, with a monthly capacity of 10,000 wafers, according to company chairman Fei-Jain Wu. Products built using the technology will account for about 10% of Chipbond's overall sales in 2012, said Wu.
Wu revealed that six to seven clients are currently validating power ICs using Chipbond's thick copper technology.
KYEC's cooperation with Chipbond will allow it to further expand its testing business, company chairman CK Lee indicated. KYEC stepped into backend production for the power IC sector in 2010, but the segment's sales ratio is currently insignificant, Lee added.