China's Spreadtrum Communications is looking to boost its handset-chip shipments in 2015, and is set to roll out its next-generation chips built using 14/16nm FinFET technologies in 2016, according to company chairman and CEO Leo Li.

Spreadtrum's revenues for 2015 are forecast to reach US$1.45 billion, rising about 25% on year, while the company's handset-IC shipments will top 500 million units, said Li.

While competitors have suffered revenue decreases since 2015, Spreadtrum generated record revenues of US$360 million in the second quarter and is on track to enjoy a record year, Li indicated. Spreadtrum's revenues for second-quarter 2015 represented increases of 13% sequentially and 16% on year.

Li also claimed his company has a better cost structure and charges lower prices than its competitors. Spreadtrum, with a workforce of only 4,000 people, shipped a total of 450 million handset chips in 2014, while rival MediaTek's shipments of 650 million units were achieved by its 15,000 employees, Li said.

In addition, Spreadtrum is set to introduce its next-generation mobile chips built using TSMC's 16nm and Intel's 14nm FinFET process technologies in 2016, Li disclosed. Volume production of Spreadtrum's 1Xnm chips is scheduled to kick off in mid-2016, Li said.

Li made the remarks at the GSA (Global Semiconductor Alliance) annual semiconductor leaders forum held in Taiwan on November 11.