Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is currently developing wafer-level LED packaging technology, which is scheduled to start mass production in 2011.
The shipments to the three US-based clients are for 25W high brightness (HB) LEDs for general lighting, and products are currently being validated by several clients, SPIL noted.
SPIL indicated that the company is focusing on the HB multi-chips LED packaging market, and through its experience in wirebond packaging , SPIL is confident it can compete with other packaging houses on production yield rates.
LED packaging does not offer high gross margins, but multi-chip packaging has higher profits compared to single-chip packaging, which is used by other LED players such as Everlight Electronics and Epistar, SPIL said.