Siliconware Precision Industries' (SPIL) fan-out type wafer level packaging (WLP) will be ready for mass production in 2016, company chairman Bough Lin said during a January 28 investors conference.

SPIL will be ready to offer its fan-out WLP technology for entry-level and mid-range IC solutions later in 2015, according to Lin, and the company will be more aggressive in providing fan-out WLP services for high-end chips such as mobile application processors.

Lin anticipates that huge end-market demand for fan-out WLP will emerge in 2016, when the technology reaches mature yield rates and manufacturing costs are lower. SPIL will have its fan-out WLP technology ready for several applications, particularly in the high-end segment such as application processors for smartphones, Lin indicated.

In addition, Lin observed that some IC foundries have been engaged in the development of fan-out WLP technology, but yield rates are still poor. Yields have to be mature enough to bring down manufacturing costs significantly, Lin said.

Taiwan Semiconductor Manufacturing Company (TSMC) has developed a InFO (integrated fan-out) wafer-level packaging process, and will reportedly be able to offer the technology in 2015.