Qualcomm's roadmap for 2H 2015 got leaked today. In the second half of 2015, the semiconductor company would introduce the Snapdragon 820, which would serve as the successor to the Snapdragon 810 chipset. Note that this leak may not be 100% accurate, so you are requested to take everything with two grains of salt.

According to the leaked snapshot of Qualcomm's internal document, the company has plans to introduce about half a dozen new mobile chips throughout this year. The Snapdragon 820 will be the star of the show, manufactured using Samsung or GlobalFoundries' 14nm FinFET process. The Snapdragon 820 would be an octa-core part, using high-performance 'TS2' cores. These could be Qualcomm's custom 64-bit ARM cores. It will be paired with the Adreno 530 GPU, and include support for LPDDR4 RAM and LTE-A Cat. 10 networks.

Next up is the Snapdragon 815, an octa-core chip, which would be made of four 'TS1i' cores and four 'TS1' cores in big.LITTLE configuration. These cores would be paired up with the Adreno 450 GPU, and include support for LPDDR4 RAM and LTE-A Cat. 10 networks. The Snapdragon 815 would be built using the existing 20nm process.

Then comes the Snapdragon 625 and Snapdragon 629 chipsets, which are one segment lower than the 800 series chips. Both the new 600 series chips will be octa-core parts, paired with the Adreno 418 GPU, and having support for LPDDR4 RAM and LTE-A Cat. 10 networks. These chips will also be built using the 20nm process.

Below that, you have the Snapdragon 620, a quad-core part based on Qualcomm's custom 'Taipan' architecture CPU cores clocked between 2.0-2.5 GHz. This will be paired with the Adreno 418 GPU. The chipset will support LPDDR3 RAM and LTE-A Cat. 10 networks.

And finally, you have the Snapdragon 616 chipset, which would consist of eight ARM Cortex A53 cores clocked between 1.8-2.2 GHz. This chip will be paired with the Adreno 408 GPU, have support for LTE Cat. 6, and be built using the existing 28nm HKMG process.