Powertec Technology (PTI) announced on April 29 that it has entered into a share purchase agreement with Nepes to acquire Nepes Pte Ltd (NPL) in Singapore.

　　With the acquisition of NPL's operationally ready, high volume 300mm electroplated wafer bumping and wafer level packaging manufacturing operations, PTI will establish its capabilities for electroplated wafer bumping and turnkey wafer level "chip scale" packaging in Singapore.

　　NPL is the only 12-inch bumping house in Singapore that can provide the complete turnkey solution, according to PTI. Its strategic location in Singapore has enhanced the interaction with world-leading semi-conductor companies located in this region.

　　"Through this acquisition, PTI will instantly expand its capacities in Singapore with experienced team to support our customers in this region" said DK Tsai, CEO of PTI.

　　"Nepes welcomes this acquisition and will maintain the corporation relationship with PTI in the future and with the support of PTI, NPL can continue to concentrate on production enhancement to stay competitive in rapidly changing semi-conducting industry," commented BK Lee, CEO of Nepes.