Packaging and testing firm Powertech Technology (PTI) has reportedly secured orders from application processor and networking chip developers, such as Broadcom and China-based RDA Microelectronics, gradually expanding its customer base in the logic IC field.

　　PTI has already built sufficient production capacity for advanced packaging technologies, such as copper pillar bump and TSV (through-silicon via), to target logic IC as well as MEMS, CMOS image sensors and other specialty chips, according to market observers.

　　In late 2013, PTI successfully grabbed lead-frame packaging orders for low- to mid-end application processors from MediaTek, the observers indicated. Orders placed by MediaTek are expected to extend to include those of mainstream packaging services including bumping and flip-chip, the observers said.

　　PTI chairman DK Tsai remarked previously that the company would continue developing its presence in the logic IC field, vying for more orders from China-, Taiwan- and US-based chip designers.

　　PTI's logic IC backend business now accounts for almost 30% of company revenues. DRAM and NAND flash were two target markets the backend house used to focus on.