Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.

　　Like copper wire, silver wire is considered an alternative that can reduce the impact of rising gold pricing, SPIL said. Besides, the plasticity of silver better serves some applications than copper wire, SPIL added.

　　SPIL has landed silver wire-bonding packaging orders from China-, Korea- and Taiwan-based companies, and expects to significantly grow sales generated from the segment in 2014, the company indicated.

　　In addition, SPIL continues to offer copper wire-bonding packaging services. The segment currently accounts for more than 60% of the company's total wire bonding revenues.