Memory backend supplier Powertech Technology (PTI) managed to push the revenue ratios of its non-memory MCP (multi-chip package) and SiP (system-in-package) services to 11% and 9%, respectively, in the first quarter of 2010 from 10% and 8% a quarter earlier, according to the company.
PTI has been gearing up for the development of SiP in recent years, and has enhanced its MCP development through taking over Spansion's Suzhou, China plant, according to company chairman DK Tsai. It now offers a one-stop shop for IC packaging solutions, and has added new customers, said Tsai.
SiP and MCP are both promising technologies that enable a set of chips to be placed in one compact package for a complete system, required by the trend towards smaller and thinner consumer electronics devices, Tsai indicated. The memory backend specialist looks to develop its 3D IC packaging and other non-DRAM segments.
Tsai also noted that PTI expects to kick off shipments for new orders placed with its Suzhou plant - which was acquired last August - in the third quarter.
PTI revealed that sales of its DRAM and flash memory packaging segments account for 74% and 25%, respectively, of its total revenues in the first quarter of 2010, compared to 83% and 17% in the same quarter of last year. Meanwhile, logic IC packaging contributed 1% to PTI's first-quarter 2010 revenues.
Tsai remarked earlier this year that PTI aims to become the number-four IC packaging and testing house worldwide in three years. The company intends to focus its efforts on growing sales from non-memory segments in 2010.