Siliconware Precision Industries (SPIL) has reported net profits of NT$2.18 billion (US$74.21 million) for the third quarter of 2013, up 25.5% on quarter and 41.1% on year. Third-quarter EPS stood at NT$0.70.

　　Gross margin hit a 4-year high of 23.1% in the third quarter compared to 20.9% in the prior quarter and 19.6% of a year earlier, as more clients have migrated to silver and copper wire bonding processes, according to company chairman Bough Lin.

　　For the first three quarters of 2013, revenues were up 4.1% on year to NT$50.51 billion, gross margin improved to 20% from 17.9% of a year earlier, while net profits dipped 9.3% on year to NT$3.63 billion. The earnings translated into an EPS of NT$1.17 for the nine-month period.

　　For the fourth quarter, SPIL expects the capacity utilization rate of wire bonding lines to stand at 78-82%, and those for flip chip packaging and bumping to reach 90-94% compared to 78-82% in the previous quarter, Lin revealed.

　　SPIL will continue to ramp up its flip chip packaging and bumping capacity in 2014, with total capex for the year to reach NT$10-11 billion compared to NT$16.5 billion projected for 2013, Lin said.