SK Hynix has developed 6-gigabit (6Gb) low-power DDR3 (LPDDR3) using 20nm-class process technology. The new mobile memory solution is designed for premium mobile devices, according to the chipmaker.

　　Four SK Hynix 6Gb LPDDR3 chips can be stacked up and realize a high density of maximum 3-gigabytes (3GB, 24Gb) solution in a single package. In consequence, this package reduces the operating power as well as the standby current by 30% and the height of the package becomes thin compared to the company's 4Gb-based one. In addition, the new solution works at ultra low-voltage of 1.2V thus it satisfies low power consumption which mobile applications demand, SK Hynix indicated.

　　The new SK Hynix mobile memory solution works at 1866Mbps and with a 32-bit I/O, it processes up to 7.4GB of data per second in a single channel and 14.8GB in a dual channel. It can be provided in a form of package-on-package (PoP) to mobile devices, SK Hynix said.

　　Samples of SK Hynix' new mobile memory solution have been already shipped to customers, with mass production scheduled for the beginning of 2014, the company disclosed.