The merger of Micron Technology and Elpida Memory has not yet taken place, but the two memory chipmakers have developed their respective plans to put more focus on products for use in smartphones and tablets, according to market observers.

　　At Micron's 12-inch fab in Singapore, the firm is looking to shift 20,000 wafers of capacity from DRAM to NAND flash chip production, the observers indicated. As a result, Micron's total production capacity for NAND flash will climb to 200,000 12-inch wafers from the current 180,000 units, the observers said.

　　Elpida reportedly plans to build additional capacity at its 12-inch wafer plant in Hiroshima, Japan, to meet growing demand for mobile DRAM chips. Monthly capacity at the facility is close to 120,000 wafers, of which 80% is utilized for the manufacture of mobile DRAM used for smartphones.

　　Further speculation is that Elpida may invest in equipment upgrades for its technology transition to 25nm from 30nm, while its Taiwan-based production subsidiary Rexchip Electronics reallocates capacity for processing 10,000-20,000 12-inch wafers to mobile DRAM.

　　Rexchip will also likely start producing chips using the newer 25nm node in the second half of 2013, the observers said. The firm currently uses Elpida's 30nm DRAM technology to make PC- and smartphone-use chips for its parent company, and owns a 12-inch fab with monthly capacity of 80,000 wafers.

　　Micron previously expressed optimism that its Elpida acquisition would close in the company's fiscal fourth quarter ending August 29, 2013.