IC backend service company Siliconware Precision Industries (SPIL) has decided to hike its capex budget for 2013 to NT$14.9 billion (US$496.14 million), up nearly 32% from NT$11.3 billion set previously, according to the company.

　　The additional budget of NT$3.6 billion will be used to ramp up the company's capacity for high-end FC CSP packaging process as well as to finance purchases of related testing equipment, the company indicated.

　　The monthly capacity for FC CSP chips will reach 37 million units in the second quarter of 2013 and further expand to 52 million units in the second half of the year, company chairman Bough Lin said earlier.

　　Market observers expect the FC CSP lines to generate revenues of NT$3-4 billion for SPIL in the fourth quarter of 2013 compared to NT$590 million in the first quarter.

　　Meanwhile, since SPIL's IC backend processes have been verified by Qualcomm, the company is expected to land more orders from the US-based chipset maker starting June as major branded smartphone vendors are ready to launch their next-generation models in the third quarter, said the observers.

　　SPIL has also experienced more pull-in orders from MediaTek, Spreadtrum Communications and Dialog Semiconductor since the second quarter, the sources added.