Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones sold in China, according to the Singapore-based IC packaging and testing firm.

STATS ChipPAC's eWLB is a fan-out wafer-level packaging technology and integration platform, which provides advantages including a space-efficient package design enabling a smaller footprint, higher density input/output (IO) and a lower package height than is possible with laminate or flip chip semiconductor packages. Spreadtrum and STATS ChipPAC are jointly working to utilize the packaging technology for product designs such as dual- and quad-core mobile processors, STATS ChipPAC indicated.

"Our extensive collaboration with Spreadtrum demonstrates the transformative advantages of eWLB technology. We have been able to rapidly optimize the overall functional performance of their silicon with an innovative packaging technology designed to optimize speed, performance and size at an overall lower cost of ownership," said Han Byung Joon, executive VP and CTO for STATS ChipPAC, in a statement.

"By combining our unique chip architecture and leading TD-SCDMA modem technology with STATS ChipPAC's technology and manufacturing leadership, we have been able to deliver high performance TD-SCDMA chipsets in a package format that continues to provide Spreadtrum and our customers with a clear competitive advantage in the China market," said Brian Chen, VP of Operations at Spreadtrum, in the same statement.