Powertech Technology (PTI) aims to become the number-four IC packaging and testing house worldwide in three years, chairman DK Tsai said at the company's annual banquet on January 25. Besides healthy growth seen in PTI's core business operations, Tsai said the company intends to focus its efforts on growing sales from non-memory segments such as backend services for logic ICs in 2010.
Tsai noted PTI has set up a R&D team to focus on 3D IC technologies such as MCP, SiP and through silicon via (TSV) packaging. PTI will open a US branch office in the first quarter, said Tsai, adding that the new regional spot is to enhance its non-memory business.
PTI also plans to increase monthly capacity for non-memory products to 80 million units in the second quarter, according to Tsai. The company's newly-acquired facility in China will contribute 36 million to the targeted volume, and a recently-established factory building in Hsinchu, Taiwan will output the remainder.
Tsai said PTI's Hsinchu plant will come on line in March with a monthly capacity of 44 million units.
PTI in August 2009 announced its takeover of Spansion's plant in Suzhou in a move to expand its business in China. Previous reports cited industry sources indicating the memory backend specialist intends to adjust its product mix by turning the flash backend facility into its major production base for non-memory packaging and testing.
A Spansion executive was quoted in a recent report saying the company plans to work more closely with PTI and other backend partners in 2010.
In related news, PTI's upcoming investors conference will be held on February 4. The company saw fourth-quarter 2009 revenues in line with its guidance, and estimated levels for the ongoing first quarter to remain level or drop slightly on quarter.