IC packaging and testing house Powertech Technology (PTI) has acquired a 12-inch electrochemical deposition (ECD) system from Nexx Systems. The Nexx Stratus will be used for copper pillar bumps and re-distribution layers in advanced packaging applications that enable smartphones, tablet PCs and other portable intelligent devices, according to the companies.
The Stratus platform is also being evaluated as part of PTI's TSV commercialization program, the companies indicated.
"Nexx Systems' Stratus will enable PTI to provide premiere technology solutions, such as copper pillar bumps passing the benefits of a flexible system with exceptional costs of ownership onto our customers as cost savings," said Scott Jewler, senior general manager for PTI.