Samsung Electronics, in response to the challenges of energy consumption, bandwidth, and capacity in the AI era, has introduced a customer-centric approach to memory chip design and manufacturing. The company's memory business executive, Lee Jin-woo, has stated that Samsung now enables its customers to independently design the base die of HBM memory and select their preferred foundry for production.

This strategic move is aimed at providing greater flexibility and customization options for AI-driven applications that require high-performance memory solutions. By allowing customers to design their own HBM memory chip base dies, Samsung is addressing the specific needs of AI applications, which often demand unique memory configurations to optimize performance.

Furthermore, by opening up the choice of foundries, Samsung is facilitating a more competitive and diverse ecosystem in the semiconductor industry. This approach not only benefits Samsung's customers but also promotes innovation and efficiency across the board.

The announcement comes at a time when the memory market is undergoing significant changes due to the rapid advancement of AI technologies. Samsung's proactive stance in embracing customization and open collaboration is expected to strengthen its position as a leading memory solutions provider in the global market.