In the wake of the global AI technology boom, Micron Technology is making significant strides to expand its global High Bandwidth Memory (HBM) production capacity. Reports from Nikkei Asia indicate that Micron has set its sights on increasing its market share in the HBM field to about 20% by the year 2025, a figure that would match its revenue share in the broader DRAM market.

Sources reveal that Micron is in the process of expanding its R&D and production facilities related to HBM at its headquarters in Boise, Idaho, USA. This expansion includes both technology validation lines and mass production lines. Furthermore, Micron is contemplating establishing HBM production capabilities in Malaysia for the first time, with a focus expected to be on the backend processes.

Data from Morgan Stanley shows that AI computing chip giant Nvidia is the largest purchaser of HBM memory, anticipated to account for approximately 48% of the global HBM production capacity. Micron announced in February of this year that its 8Hi 24GB HBM3E memory has entered mass production and is supplying to Nvidia's H200 chips. Micron claims that this memory offers a 30% reduction in power consumption compared to competing products, which will aid in reducing operational costs for data centers.

This strategic move by Micron demonstrates its ambitions within the global semiconductor market and its proactive response to the rapid development of AI technology. With the expansion of HBM memory production, Micron is poised to occupy a more significant position in the global semiconductor market and provide stronger support for the fields of AI and high-performance computing.