Samsung Electronics Co., will build a 40 billion yen ($281 million) advanced chip packaging research and development center in Japan amid improving ties between the two neighboring countries.

Samsung will set up the research facility in Yokohama, southwest of Tokyo, to develop new chip packaging technology and deepen ties with Japanese makers of chipmaking equipment and materials, according to an announcement by the city of Yokohama and media reports.

Separately, Japan's industry ministry said it would offer Samsung subsidies worth up to 20 billion yen to support the revitalization of domestic chip manufacturing.

South Korea’s Samsung Electronics Co., the world’s largest memory chipmaker, will build a 40 billion yen ($281 million) advanced chip packaging research and development center in Japan amid improving ties between the two neighboring countries.

Samsung will set up the research facility in Yokohama, southwest of Tokyo, to develop new chip packaging technology and deepen ties with Japanese makers of chipmaking equipment and materials, according to an announcement by the city of Yokohama and media reports.

Separately, Japan's industry ministry said it would offer Samsung subsidies worth up to 20 billion yen to support the revitalization of domestic chip manufacturing.

At the facility, Samsung will research back-end process technology in partnership with Japanese companies for artificial intelligence and 5G chips. Samsung expects the R&D center to strengthen its “leadership in chips.”