JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD318: Compression Attached Memory Module (CAMM2) Common Standard. This groundbreaking standard defines the electrical and mechanical requirements for both Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LPDDR5/5X SDRAM CAMM2s) in a single, comprehensive document. JESD318 CAMM2 is available for download from the JEDEC website.

DDR5 and LPDDR5/5X CAMM2s cater to distinct use cases. DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments.

While JESD318 CAMM2 defines a common connector design for both DDR5 and LPDDR5/X, it is crucial to note that the pinouts for each differ. To support different motherboard designs, intentional variations in mounting procedures between DDR5 and LPDDR5/X CAMM2s prevent the mounting of a module where it should not go.

As announced earlier this year, JESD318 CAMM2 supports stackable CAMM2s: dual-channel (DC) and single-channel (SC). By splitting the dual-channel CAMM2 connector lengthwise into two single-channel CAMM2 connectors, each connector half can elevate the CAMM2 to a different level. The first connector half supports one DDR5 memory channel at 2.85 mm height while the second half supports a different DDR5 memory channel at 7.5 mm height. Or, the entire CAMM2 connector can be used with a dual-channel CAMM2. This scalability from single-channel and dual-channel configurations to future multi-channel setups promises a significant boost in memory capacity.