According to Korean media reports, semiconductor equipment manufacturer Lam Research is working with SK Hynix to improve the efficiency of extreme ultraviolet (EUV) exposure by improving dry photoresist technology to improve DRAM production efficiency.
Previously, Lam Research worked with ASML and the Belgian semiconductor institute IMEC to develop dry photoresist technology. Recently, Lam Research announced that it will provide dry photoresist primer and dry development process equipment to SK Hynix.
Photoresist is a photosensitizer used in the semiconductor exposure process. After it is applied and light is emitted, circuit patterns are engraved on the wafer. In the past, semiconductor manufacturers have been using liquid photoresists.
Dry photoresists developed by Lam Research et al. form thin films by operations such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). The technology is expected to increase EUV process resolution and reduce costs.
According to Lam Research, cost reduction is easy because dry photoresist technology uses 5 to 10 times less raw material than wet photoresist and can reduce the amount of light irradiated.