IC backend house ASE Technology Holding and wafer probe card specialist Chunghwa Precision Test Tech (CHPT) are both engaged in the supply chain for HiSilicon's next-generation flagship solution dubbed Kirin 985 that will be manufactured using TSMC's EUV-based 7nm process technology, with volume production slated to kick off in the latter half of the second quarter, according to industry sources.

HiSilicon continues to rely on its OSAT partners for the backend part of its high-end Kirin 9 series chips, the sources indicated. The fabless chipmaker had once considered adopting TSMC's advanced InFO (integrated fan-out) packaging, but the idea was abandoned for cost reasons, the sources continued.

The new Kirin 985 chip will employ flip-chip package-on-package (FC-PoP) services offered by Advanced Semiconductor Engineering (ASE), and testing services from Siliconware Precision Industries (SPIL), the sources said. ASE and SPIL both operate under ASE Technology.

CHPT, another supplier for the upcoming Kirin 985 SoC, is also expected to see its revenues driven by a pull-in of orders for the solution later in the second quarter, the sources noted.

ASE Technology and CHPT have both declined to comment on the report, citing customer confidentiality.

HiSilicon's first 7nm EUV chip is expected to power Huawei's upcoming smartphone tentatively dubbed Mate 30 slated for launch in September or October, according to the sources.