The number of 300mm wafer fabrication facilities in operation continues to increase. With nine new 300mm wafer fabs scheduled to open in 2019, the worldwide number of operational 300mm wafer fabs is expected to climb to 121 in 2019 and grow to a total of 138 fabs by the end of 2023, according to IC Insights.

Of the nine 12-inch fabs set to open in 2019, five are located in China, said IC Insights. Nine new fabs this year would be the most opened in a single year since 12 were opened in 2007, IC Insights continued.

Another six new fabs are scheduled to open in 2020, IC Insights indicated. All of the new fabs coming in 2019 and 2020 will be for DRAM and flash memory or for foundry capacity.

IC Insights disclosed that at the end of 2018, there were 112 production-class IC fabs utilizing 300mm wafers. The number excluded R&D fabs and several high-volume fabs that make "non-IC" products using 300mm wafers.

The number of active volume-production 300mm fabs declined for the first time in 2013 when ProMOS closed two large fabs and two other fabs that were scheduled to open in 2013 were delayed until 2014, IC Insights identified. The quantity of 300mm fabs has risen every year since. IC Insights added that 300mm wafers took over as the industry's primary wafer size in terms of total surface area used in 2008.

IC Insights forecast that by the end of 2023, 26 more fabs will be in operation than in 2018 bringing the total number of 300mm fabs used for IC production to 138.