China has a population of nearly 1.4 billion, a large consumer base and the largest market for mobile phones, its Huawei, OPPO and VIVO rank among the top five in the world. China accounts for 30% of the global market with an ever-increasing demand for personal data storage. Meanwhile, Huawei, Lenovo, Inspur and other server makers such as Baidu, Tencent and Alibaba, together with the rapid development of China's Internet of Things, demand for semiconductor chips in China, especially the huge demand for memory. However, China lacks key technologies in memory chips and almost 90% rely on imports.
In 2014, the State released the Outline for Promoting the Development of the National Integrated Circuit Industry. In 2015, the State released the "Outline for Action on Promoting the Development of Big Data" and promoted the sharing of government information systems and public data. In response to the call of national policies, the National Fund has stepped up investment in IC design, manufacturing, packaging, testing and equipment and other sectors. Local governments have also set up integrated circuit industry funds to encourage domestic enterprises to innovate independently.
In terms of NAND Flash, Unigroup is a leader in China's storage industry, not only building a national storage base with the YMTC in Wuhan but also invested in the construction of Nanjing Semiconductor Industry Base, IC International City in Chengdu and Dongguan Cloud Industrial City, and strengthened its investment in packaging, testing, SSD R & D and sales. Currently, Unigroup has a total investment of 24 billion U.S. dollars in Wuhan National Storage Base No. 1 production and power plant to achieve an early cap, while the Unigroup / YMTC has developed a 32-layer 3D NAND, will be in 2018 Q2 trial production. Although Unigroup / YMTC still lags far behind the 64-layer 3D NAND produced by Samsung and Toshiba / Western Digital, it symbolizes a major manufacturing breakthrough in China. After the foundation is laid, it will focus on the development of the next generation of 64 Layer 3D NAND, to further shorten the distance with the international manufacturers.
In DRAM, the big fund has been the second largest shareholder of Giga Device, Giga Device is with Hefei Industrial Investment Holdings Limited to carry out research and development with DRAM and other memory, the goal is to be successful in research and development by the end of 2018. Hefei and Fujian Jinjiang also focus on DRAM production, including Fujian Jinhua FAB main plant storage cap, a planned Q3 in 2018 officially put into operation. Hefei Changxin Memory Factory is planned to be completed in 2017 and equipment installation and commissioning will be completed in the first half of 2018, and the product research and development of the second half of the year is expected to be completed and put into production. With the continuous growth of domestic enterprises, China's memory industry will make a difference in the next five years, and catch up with the international advanced technology level. |