Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have said they currently have no plans to adjust planned capex for 2011. Meanwhile, both IC packagers agreed that whether sales would enjoy peak season effects in 2011 should be monitored.
Semiconductor inventories reportedly have been piling up throughout the electronics supply chain, casting a shadow on companies' business prospects.
ASE annually injects US$400-450 million into capacity for copper wirebonding processing and low pin-count packaging, according to company COO Tien Wu. Plus investment in advanced technologies including wafer-level packaging, flip-chip (FC) and aQFN (advanced QFN), ASE's capex goal of US$800 million for 2011 should be implemented, Wu said.
SPIL also reiterated that its planned capex budget for 2011 of NT$10 billion (US$347 million) remains unchanged. The company is set to expand capacity at its Suzhou, China plant by 50% by installing an additional 500 sets of copper wirebonders at the facility between the second half of 2011 and early 2012.
ASE and SPIL are scheduled to detail their operations in the second quarter of 2011 and guidance for the third quarter at their respective investors meetings on July 27 and August 4.