Packaging and testing company Powertech Technology has purchased wafer-level packaging equipment from Ultratech SE Asia for NT$544 million (US$17 million), according to a company filing with the Taiwan Stock Exchange (TSE).

PTI disclosed previously its 2016 capex would be NT$12 billion, which will be used to expand the company's bumping, flip-chip and wirebonding capacity. Another capex focus is the development of panel-level fan-out packaging solutions, which are expected to enter volume production in the second half of 2017.

PTI also disclosed plans to inject an additional US$25 million into its new plant in Xian, China, which provides backend services for Micron Technology.