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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2020-05-26
MediaTek has not promised chip supply to Huawei yet
2020-05-26
Samsung Elevates Data Protection for Mobile Devices with New Security Chip Solution
2020-05-26
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GlobalFoundries to close its Chengdu, China factory
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Notice : A Significant Adjustment to DRAM Product Quotation System of ChinaFlashMarket
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Nokia achieves world-record 5G speeds
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Stock Information
Update: 11-21 12:59,Data has delay
Samsung KRW 94700 -5.86%
SK Hynix KRW 521500 -8.67%
KIOXIA JPY 9672 -14.67%
Micron USD 201.370 -10.87%
WDC USD 140.230 -8.92%
SanDisk USD 195.960 -20.33%
Nanya TWD 140.0 -9.97%
Winbond TWD 52.2 -10.00%
Phison TWD 1065 -9.75%
SMI USD 80.160 -5.47%
Maxio CNY 46.42 -4.07%
ASolid TWD 65.0 -7.80%
Longsys CNY 232.00 -11.02%
Seagate USD 240.500 -7.19%
Innodisk TWD 492.0 -6.11%
Transcend TWD 184.0 -8.91%
A-DATA TWD 173.5 -8.92%
PENG USD 17.640 -1.23%
Netac CNY 27.30 -8.02%
BWCC CNY 103.20 -8.41%
Techwinsemi CNY 222.71 -10.00%
DAWEI CNY 32.98 -9.99%
OSE TWD 46.25 -4.93%
PTI TWD 149.5 -5.68%
JCET CNY 35.15 -2.69%
ASE TWD 207.0 -6.97%
TFME CNY 35.65 -3.02%
HT-tech CNY 10.76 -2.45%