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Chipmakers to scale up 96-layer 3D NAND flash output in 2Q19
Source: DIGITIMES   Editor: Amanda   Update Time :2019/3/5 16:42:51

The global output of 96-layer 3D NAND flash memory is set to expand starting the second quarter of 2019, which may bring more variables to the market and prices this year, according to market observers.

NAND flash prices have been falling since 2018, due mainly to an increase in the supply of 64- and 72-layer 3D NAND chips. The memory prices even fell to a record low of under US$0.10 per gigabyte at the end of the year, the observers indicated.

Major chipmakers have moved to slow down their capacity expansion pace aiming to stop NAND flash memory prices from falling further. However, improvement in their new-generation 96-layer 3D NAND production yield rates will still result in supply-side growth, the observers said.

The NAND flash memory market remains in an oversupply situation, and a further increase in supply would not be favorable to the market and prices, the observers continued.

Industry leader Samsung has improved substantially its 96-layer 3D NAND production yield rate and is set to enter mass production of 512GB UFS 3.0 solutions. Samsung also has plans to roll out 1TB solutions utilizing 96-layer process technology in the second half of 2019, while making progress in developing quad-level cell (QLC) process technology.

Toshiba has rolled out recently its new-generation SSD and UFS 3.0 solutions utilizing 96-layer 3D NAND process technology, while Micron has introduced a new SSD series based on 96-layer TLC 3D NAND technology. Micron has also developed 96-layer QLC NAND technology for 1TB devices, with volume production slated for second-quarter 2019.


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