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Micron Works With Qualcomm to Enable 5G Automotive Platform for Next-Generation Vehicles
Source: Micron   Editor: Amanda   Update Time :2019/2/28 16:04:33

Micron Technology, Inc. , an industry leader in innovative memory and storage solutions, announced it is working with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to enable an advanced automotive connectivity solution that leverages 5G networks for autonomous driving and direct cellular vehicle-to-everything (C-V2X) communication. The new Qualcomm® Snapdragon™ Automotive 5G Platform will feature a custom Micron 149 ball count multichip package, allowing for speeds of up to 20 times faster than current LTE-Advanced modems. Faster modem speeds widen the possibilities for vehicles to connect to other vehicles, roadside infrastructure and beyond.

The Snapdragon Automotive 5G Platform with integrated C-V2X direct communication technology is designed to provide the low latency, high data speed, and reliable cellular connection coverage required for next-generation connected cars and autonomous driving. Micron created a portfolio of ultra-small 8x9.5mm, 149 ball count multichip package (MCP) solutions with SLC NAND plus LPDDR4 rated at automotive temperature grade to pair with the Snapdragon Automotive 5G Platform, creating opportunities for immersive in-vehicle experiences and automotive safety.

“5G technology will drive further innovation in connected vehicles and deliver advanced functionality that is necessary for next-generation vehicles,” said Kris Baxter, vice president of marketing for Micron’s Embedded Business Unit. “Integrating Micron’s multichip package with the Snapdragon Automotive 5G Platform will accelerate the push toward digitally enabled transportation solutions that enhance reliability and safety.”

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