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AI, 5G to boost penetration of HDI PCBs in notebooks
Source: DIGITIMES   Editor: Amanda   Update Time :2019/1/17 17:51:36

Notebooks are getting smart along with growing application of 5G and AI technologies, driving up demand for high-density interconnect (HDI) PCBs to support upgrades in designs, according to industry sources.

Processor upgrades are the major driver for increasing penetration of HDI board technology in notebooks as a result of increasingly intense competition among major chipmakers, the sources said, adding that even mobile chip giant Qualcomm already released in early December 2018 its 7nm Snapdragon 8cx processor for notebooks to challenge Intel's strong presence in the sector.

At the just-concluded CES 2019, Intel launched Project Athena to push notebook makers to create advanced models with 5G and AI and announced that its 10nm Ice Lake processors will arrive sometime this year. Vendors including Acer, Asus, Dell, Google, HP, Lenovo, Microsoft, Samsung, and Sharp are all working on Project Athena, and devices will include Chrome- and Windows-powered models.

Both Intel and Qualcomm have highlighted the functions of constant Internet connectivity, long battery life and instant responsiveness in their new-generation notebook processors. And HDI PCBs, boasting thinner lines, tighter space, smaller borehole diameter and higher number of layers than general PCBs, can best support the functions, industry sources commented.

The sources continued that HDI technology can also address the overheating and high signal loss issues facing notebooks under super-high data transmission speed in the 5G era.

Meanwhile, SSD prices have dropped significantly along with lingering NAND flash price falls, pushing up penetration of SSDs in notebooks and providing one more outlet for HDI PCBs as SSD modules usually adopt HDI boards, the sources indicated.

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