Micron Technology's wafer plant in Taichung, central Taiwan is scaling up its output of DRAM chips built using 1Xnm process technology, and will have more than half of its total production capacity manufactured using the newer node sometime in the second half of 2017, according to factory site director KC Hsu.
Micron's Taichung fab was formerly Rexchip Electronics, which the US vendor took over as a result of its acquisition of Japan-based Elpida Memory. The facility is making progress in transitioning from 25nm to 1Xnm node production processes, said Hsu.
Micron expects to enter volume shipments of 1Xnm-made DRAM chips for end-market products in the second half of 2017, Hsu indicated.
Micron also has a DRAM fab in Taoyuan, northern Taiwan engaged in the manufacture of 20nm chips. The facility was formerly Inotera Memories, which the US vendor took over at the end of 2016.
In addition, Micron has plans to build a backend facility in Taichung which is part of the company's investment project in Taiwan, Hsu noted. Micron is looking to invest a total of US$2 billion in 2016 and 2017 to enhance the technology capability of its local sites, Hsu said.