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Yangtze Memory gearing up for transition to 128-layer 3D NAND 18/11/14
China's Yangtze Memory Technology (YMTC) has started delivering samples of its 64-layer 3D NAND chip with volume production likely to kick off in the third quarter of 2019, according to sources familiar with the matter.
Apple Reports Fourth Quarter Results 18/11/02
Apple today announced financial results for its fiscal 2018 fourth quarter ended September 29, 2018.
Samsung, SK Hynix stepping up DRAM EUV technology R&D 18/10/23
Samsung Electronics and SK Hynix have already kicked off their respective DRAM EUV technology R&D, with Samsung likely to soon move the process to commercial production, according to Korea media reports.
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2010-06-24
Skymedi to sell new shares via private placement
2010-06-24
Elpida develops 2Gb GDDR5
2010-06-24
SDRAM maker Etron to ship USB 3.0 controllers in 4Q10
2010-06-23
Carriers manage inventory ahead of iPhone 4 launch
2010-06-23
TPV-Inventec joint venture to be set up in Hong Kong not Taiwan
2010-06-23
Rexchip elects new board members
2010-06-22
UMC expects to sample 3D stacked chips using 28nm in 2011
2010-06-21
Elpida, PTI and UMC enter joint development deal for 3D-TSV technology
2010-06-21
Powerchip surges in 1Q10 DRAM ranking
2010-06-21
Winbond president:NOR flash supply gap reaches 20%
2010-06-21
ProMOS says trial production for Elpida 63nm DDR3 chips a success
2010-06-18
DRAM spot market still quiet
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Samsung KRW 44250.00 +0.34
TOSHIBA JPY 3975.00 +3.65
Hynix KRW 71800.00 +1.99
Micron USD 38.03 +0.48
Intel USD 47.09 -0.63
WDC USD 45.05 +0.81
UNIS CNY 37.98 +2.65
Nanya TWD 55.90 -1.06
Phison TWD 220.50 -1.56
SMI USD 35.15 -0.20
ALCOR TWD 16.60 +0.30
Marvell USD 15.73 +0.06
ASolid TWD 46.00 +0.55
3S TWD 19.85 -0.25
Realtek TWD 129.50 0.00
Goke CNY 43.40 +1.19
OSE TWD 7.40 -5.13
PTI TWD 69.90 +1.30
JCET CNY 11.16 +1.18
ASE TWD 59.50 0.00
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