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TSMC to be only supplier of Apple A13 chips in 2019 18/10/12
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2010-06-22
UMC expects to sample 3D stacked chips using 28nm in 2011
2010-06-21
Elpida, PTI and UMC enter joint development deal for 3D-TSV technology
2010-06-21
Powerchip surges in 1Q10 DRAM ranking
2010-06-21
Winbond president:NOR flash supply gap reaches 20%
2010-06-21
ProMOS says trial production for Elpida 63nm DDR3 chips a success
2010-06-18
DRAM spot market still quiet
2010-06-18
Current DRAM chip prices are too high
2010-06-18
IC distributor Zenitron expects record high 3Q10 revenues
2010-06-17
SPIL to raise 2010 capex budget for copper wire bonding equipment procurement
2010-06-15
Nanya to volume produce mobile RAM chips in 3Q10
2010-06-15
Nanya, Rexchip ahead of schedule on advanced processes
2010-06-14
Transcend expands product mix to include multimedia players
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Samsung KRW 44300.00 +1.61
TOSHIBA JPY 3310.00 +2.64
Hynix KRW 70900.00 +1.72
Micron USD 43.21 +2.05
Intel USD 45.94 +3.17
WDC USD 56.06 +2.86
UNIS CNY 32.20 -6.42
Nanya TWD 56.00 +3.51
Phison TWD 201.00 +1.52
SMI USD 46.70 +0.60
ALCOR TWD 17.05 0.00
Marvell USD 18.87 +4.14
ASolid TWD 42.70 0.00
3S TWD 20.95 0.00
Realtek TWD 112.50 +2.27
Goke CNY 40.00 +0.60
Transcend TWD 67.00 +0.90
A-DATA TWD 41.30 +2.35
SiS TWD 8.33 +2.46
OSE TWD 8.88 +1.60
PTI TWD 70.80 +1.87
JCET CNY 9.90 +4.72
ASE TWD 65.00 +1.56
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