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China's ZTE removed chief compliance officer before U.S. sanction: source 18/04/19
ZTE Corp's chief compliance and chief legal officer was removed from his posts more than a month before the Chinese telecom equipment maker was slapped with U.S. sanctions this week, a company source with direct knowledge of the situation told Reuters.
U.S. Cuts Off China's ZTE From American Tech for Seven Years 18/04/17
The U.S. government said Chinese telecommunications-gear maker ZTE Corp. violated the terms of a sanctions settlement and imposed a seven-year ban on purchases of crucial American technology needed to keep it competitive.
Yangtze Memory obtains first 3D NAND chip orders 18/04/16
Yangtze Memory Technologies (YMTC) under China's state-owned Tsinghua Unigroup has obtained its first orders for commercial production of over 10,000 3D NAND flash chips for use in 8GB SD memory cards, according to Charles Kau, acting chairman of YMTC and executive VP of Tsinghua Unigroup.
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2009-12-28
Contract quotes for NAND flash chips remain flat for 2H December
2009-12-25
DRAM to fall into shortage in 2010
2009-12-25
Unexpected price rally at DRAM spot market, says inSpectrum
2009-12-25
ChipMOS loses DRAM packaging patent lawsuit against Walton
2009-12-24
Powerchip’s board approves debt repayment plans
2009-12-24
Quake costs TSMC half day of production
2009-12-24
Rexchip to ramp 40nm-class DRAM production in 2Q10, says Elpida
2009-12-24
IC distributor PCT optimistic about revenue growth in 2010
2009-12-24
Memory segment to fall by less than overall chip revenues in 2009, says Gartner
2009-12-24
InnoDisk intros 2TB PCIe SSD
2009-12-24
DRAM capex to hike 80% in 2010
2009-12-23
Intel, Micron seek to regain NAND process lead
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