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SSD vane: BGA SSD size and package quite same as UFS, open the new opportunities of mobile market 18/03/16
SSD Form Factor has undergone a revolutionary evolution as 3D NAND expands its application and packaging technologies. SSD from the original 2.5-inch form factor to mSATA, M.2 (2280/2260), and then to highly integrated BGA package, its size can be done with embedded products eMMC / UFS equivalent to
Unigroup will mass-produce 32-layer 3D NAND in 2018 and begin to develop the next-generation 64-layer 3D NAND 18/03/14
China has a population of nearly 1.4 billion, a large consumer base and the largest market for mobile phones, its Huawei, OPPO and VIVO rank among the top five in the world.
How to tell the good from bad of SSD quality? 18/03/13
ChinaFlashMarket think there are three ways to do it.
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HTC to limit number of new smartphones for 2018
MediaTek aims to hike market share, profitability in 2018
Will Increasing Demand of Semiconductor Materials Lead to Supply Crisis in 2019?
Shipments of iPhone X to reach 30-35 million units in 4Q17, say sources
Taiwan ODMs looking to transform into industrial brands, says Wistron chairman
MediaTek may land modem chip orders from Apple in 2018
Qualcomm Board Unanimously Rejects Broadcom & Silver Lake Director Nominees
Global shipments of wearable devices to nearly double by 2021, IDC says
Acer enjoys growing notebook sales in North America during 2017 holiday season
Shipments of iPhone X to reach 30-35 million units in 4Q17, say sources
Top notebook vendors and ODMs see mild on-year shipment growths in November
Samsung Electronics and LG Electronics to Introduce Their New Low-End Smartphones at CES 2018
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