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Winbond board approves NT$20 billion for new 12-inch plant establishment 18/08/20
Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to start constructing its new 12-inch wafer plant at the Kaohsiung Science Park (KSP), southern Taiwan in the fourth quarter of 2018, with total expenditures estimated at about NT$20.36 billion (US$662 m
TSMC board approves US$4.5 billion for capacity expansion 18/08/15
The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of approximately US$4.49 billion for new fabs construction, advanced-node and specialty technology upgrades and related capacity expansions.
Tsinghua Unigroup to buy stake in ASE subsidiary 18/08/14
Tsinghua Unigroup has agreed to buy a 30% stake in Suzhou ASEN Semiconductors, which is wholly owned by ASE Technology Holding, according to the Taiwan-based IC assembly and test services company.
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UMC in trading halt pending announcement
Huawei to launch commercial 5G solutions, mobile chips in March 2019
Apple and Samsung settle after seven years of court battles
MediaTek and Ericsson collaborate to accelerate and expand NB-IoT device ecosystem
Global 1Q18 semiconductor industry posts US$115.8 billion in revenues, IHS says
SD Express is a New Memory Card Standard That Leverages PCIe and NVMe
Realtek Intros RTS5762 NVMe SSD Controller Capable of 3500 MB/s Reads
TSMC is Ramping Up 7nm Production, 5nm Next Year
Silicon wafer prices likely to spiral upward through 2025
Notebook ODMs asking clients to absorb increased component costs
Entry-level smartphone SoCs likely to exit from market
TSMC ramping up 7nm chip production
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