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Winbond board approves NT$20 billion for new 12-inch plant establishment 18/08/20
Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to start constructing its new 12-inch wafer plant at the Kaohsiung Science Park (KSP), southern Taiwan in the fourth quarter of 2018, with total expenditures estimated at about NT$20.36 billion (US$662 m
TSMC board approves US$4.5 billion for capacity expansion 18/08/15
The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of approximately US$4.49 billion for new fabs construction, advanced-node and specialty technology upgrades and related capacity expansions.
Tsinghua Unigroup to buy stake in ASE subsidiary 18/08/14
Tsinghua Unigroup has agreed to buy a 30% stake in Suzhou ASEN Semiconductors, which is wholly owned by ASE Technology Holding, according to the Taiwan-based IC assembly and test services company.
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2018-06-29
UMC in trading halt pending announcement
2018-06-28
Huawei to launch commercial 5G solutions, mobile chips in March 2019
2018-06-28
Apple and Samsung settle after seven years of court battles
2018-06-28
MediaTek and Ericsson collaborate to accelerate and expand NB-IoT device ecosystem
2018-06-27
Global 1Q18 semiconductor industry posts US$115.8 billion in revenues, IHS says
2018-06-27
SD Express is a New Memory Card Standard That Leverages PCIe and NVMe
2018-06-27
Realtek Intros RTS5762 NVMe SSD Controller Capable of 3500 MB/s Reads
2018-06-27
TSMC is Ramping Up 7nm Production, 5nm Next Year
2018-06-26
Silicon wafer prices likely to spiral upward through 2025
2018-06-25
Notebook ODMs asking clients to absorb increased component costs
2018-06-25
Entry-level smartphone SoCs likely to exit from market
2018-06-22
TSMC ramping up 7nm chip production
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