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SSD vane: BGA SSD size and package quite same as UFS, open the new opportunities of mobile market 18/03/16
SSD Form Factor has undergone a revolutionary evolution as 3D NAND expands its application and packaging technologies. SSD from the original 2.5-inch form factor to mSATA, M.2 (2280/2260), and then to highly integrated BGA package, its size can be done with embedded products eMMC / UFS equivalent to
Unigroup will mass-produce 32-layer 3D NAND in 2018 and begin to develop the next-generation 64-layer 3D NAND 18/03/14
China has a population of nearly 1.4 billion, a large consumer base and the largest market for mobile phones, its Huawei, OPPO and VIVO rank among the top five in the world.
How to tell the good from bad of SSD quality? 18/03/13
ChinaFlashMarket think there are three ways to do it.
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Realtek posts revenue growth for January
Oppo to begin marketing R11s in Japan on Feb 9
Taiwan supply chain to turn profitable on robust Apple orders in 2018
Worldwide tablet shipments to reach new low in 1Q18
iPhone shipments up 66% on quarter in October-December 2017, says Apple
Compal seeking comeback to desktop ODM market in 2018
Intel, MediaTek well galvanized to perform better in 2018
Apple sees record profit, despite selling fewer iPhones
With Samsung deal, Qualcomm doubles down on licensing practices
HTC completes deal with Google
First-tier China smartphone brands to bring more competition in 2018
JEDEC Publishes Universal Flash Storage (UFS & UFSHCI) v3.0 and UFS Card v1.1
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JCET CNY 21.40 +3.83
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